发明名称 |
Siloxanmodifizierte Poyamidharzzusammensetzung, Klebefilme, Klebefolie, und Halbleiterbauelement |
摘要 |
An adhesive sheet comprises a polyimide base layer and an adhesive layer (a) disposed on at least one side of the polyimide base layer, the adhesive layer (a) being a layer of a B-stage cured product of a siloxane-modified polyamideimide resin composition comprising 100 parts by weight of a siloxane-modified polyamideimide resin and 1 to 200 parts by weight of a thermosetting resin ingredient. A chip-size package board is produced by making a through-hole in the adhesive sheet, laminating a copper foil on the adhesive layer (a), forming a circuit by removing unnecessary parts of the copper foil by etching, and then gold plating a surface of the circuit. A semiconductor device is prepared by bonding a semiconductor chip to the surface of the chip-size package board bearing the circuit, connecting the circuit of the chip-size package board to bonding pads of the semiconductor chip, and sealing the circuit of the chip-size package board, the bonding wires and the semiconductor chip with a molded resin. |
申请公布号 |
DE69832944(D1) |
申请公布日期 |
2006.02.02 |
申请号 |
DE1998632944 |
申请日期 |
1998.10.29 |
申请人 |
HITACHI CHEMICAL CO., LTD. |
发明人 |
TAKEUCHI, KAZUMASA;SAITO, TETSUYA;NANAUMI, KEN |
分类号 |
B32B15/08;C08G18/32;C08G18/34;C08G18/61;C08L63/00;C08L79/08;C09D183/10;C09J7/02;C09J163/08;C09J179/08;H01L21/48;H01L21/58;H01L23/29;H01L23/498 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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