EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

摘要

Disclosed is an epoxy resin composition essentially containing (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) silica and (E) alumina and/or aluminum hydroxide. The aluminum element content in the epoxy resin composition is not less than 0.25% by weight and not more than 5% by weight, and silica having an average particle diameter of not more than 25 µm accounts for not less than 70% by weight of the total silica. Such an epoxy resin composition for semiconductor sealing and an semiconductor device wherein a semiconductor element is sealed using this epoxy resin composition are excellent in reliability during operation at high temperatures.