发明名称 |
POLISHING DEVICE AND POLISHING METHOD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing device and a method capable of improving nonuniformity in thickness between materials to be polished or on one material to be polished and facilitating end-point control of polishing. <P>SOLUTION: The polishing device has a polishing chamber 36 for polishing an object to be polished and a control device 34. A temperature sensor 48 for measuring a temperature of an atmosphere in the polishing chamber; a polishing table 12 having a polishing surface 10; and a nozzle 16 for feeding a polishing liquid to the polishing surface are provided in the polishing chamber. The temperature of the polishing liquid is controlled based on a value of a polishing target temperature relative to a temperature of a contacting surface of the object to be polished and the polishing surface inputted to the control device and the value measured by the temperature sensor 48. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
申请公布号 |
JP2006026897(A) |
申请公布日期 |
2006.02.02 |
申请号 |
JP20050298383 |
申请日期 |
2005.10.13 |
申请人 |
EBARA CORP |
发明人 |
KAWAMOTO TAKAYOSHI;KIMURA NORIO;YOSHIDA HIROSHI;YASUDA HOZUMI |
分类号 |
B24B37/013;B24B37/015;B24B49/14;H01L21/304 |
主分类号 |
B24B37/013 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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