| 摘要 |
PROBLEM TO BE SOLVED: To prevent the horizontal slippage of carriers, and to shorten the bonding time. SOLUTION: In bonding equipment 20, where a tape carrier 2 is conveyed by rollers R1-R6 and a chip 12 is bonded at a specified position, the rollers R1-R6 are opened and closed instantaneously, and the horizontal slippages can be prevented by the restoration capability of the tape carrier 2 itself. Slacks are alternately formed between rollers R2 and R3, as well as between R4 and R5 due to the delivery of the tape carrier 2, while the slack on both sides can be dissolved alternately due to the delivery of the tape carrier 2. Since the tape carrier can be delivered at a faster pace when the slack is dissolved, the whole conveying time can be set to be short and a long bonding time can be secured. The chip 12 is supplied to the specified position of the tape carrier 2, after offsetting, and the chip 12 is reset at a regular position after correcting the position, which is performed after the recognition of the electrode pad position of the chip. The bonding of the chip to the carrier can be performed accurately, in a short amount of time. COPYRIGHT: (C)2006,JPO&NCIPI
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