| 摘要 |
PROBLEM TO BE SOLVED: To provide a chemical coating machine and its method by which pattern lithography is attained for a short time without using complex equipment constitution. SOLUTION: The chemical coating machine (a coating unit) includes a wafer chuck 6 holding a substrate 1, a coating nozzle 3 for coating a chemical 8 onto the substrate 1 held by the wafer chuck 6, a substrate position measuring mechanism 4 which calculates a relative position of the coating nozzle 3 to measurement marks 2 provided on the substrate 1, and a computer 5 which memorizes pattern information to form a pattern on the substrate 1, and performs drive control and chemical feeding control of the coating nozzle 3 on the basis of the relative position and the pattern information. COPYRIGHT: (C)2006,JPO&NCIPI
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