发明名称 SOLDER COATING APPARATUS AND ITS METHOD
摘要 PROBLEM TO BE SOLVED: To provide a solder coating apparatus and its method by which solder is properly applied on the entire joining face and by which high joining strength can be obtained. SOLUTION: The solder coating apparatus 1 forms a solder layer on the target surface of a work 21 and is equipped with: a solder melting tank 11 for storing fused solder 13; a heater 12 for heating the solder 13 in the solder melting tank 11; a diaphragm 14 that is partly immersed in the melted solder 13 in the solder melting tank 11, with the immersed part in the solder opposed to the target surface of the work 21; an ultrasonic wave oscillator 15 and a ultrasonic wave horn 16 that vibrate the diaphragm 14; and a carriage 17 and a guide rail 18 that relatively move the diaphragm 14 and the work 21 in parallel with the direction of the plate face of the diaphragm 14 in the part immersed in the solder 13. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006026677(A) 申请公布日期 2006.02.02
申请号 JP20040208081 申请日期 2004.07.15
申请人 TOYOTA MOTOR CORP;NIHON ALMIT CO LTD 发明人 IKUTA HIROYUKI;SAWAMURA SADA;ASAO TAKESHI
分类号 B23K1/08;B23K103/10 主分类号 B23K1/08
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