| 摘要 |
PROBLEM TO BE SOLVED: To obtain a low dielectric/heat-resistant resin composition which can be used in a high frequency band and has a low dielectric property and high heat resistance. SOLUTION: This low dielectric/heat-resistant resin composition is characterized by comprising 100 pts.wt. of a syndiotactic polystyrene-based resin and 1 to 8 wt.% of intercalation-modified/surface-treated clay subjected to a silicate layer surface treatment using an alkoxysilane having at least one phenyl-substituted group and an intercalation treatment using an ammonium salt. The intercalation-modified/surface-treated clay is added in a relative small amount to obtain the resin composition having a low dielectric property, high heat resistance, and excellent processability. COPYRIGHT: (C)2006,JPO&NCIPI |
