Method of fabricating robust nucleation/seed layers for subsequent deposition/fill of metallization layers

摘要

A method for fabricating a seed layer. A seed layer ( 126 ) is deposited over a barrier layer ( 124 ) using a three-step process comprising a low AC bias power step, a high AC bias power step, and a lower/zero AC bias power step. The low AC bias power step provides low overhang. The high AC bias power step provides good sidewall coverage. The lower/zero AC bias step recovers areas exposed by re-sputtering during the high AC bias power step.