发明名称 |
Mixed alloy lead-free solder paste |
摘要 |
This invention is to a mixed alloy lead-free solder paste, a method of making the solder paste, and a method of using the solder paste. The solder paste comprises particles of a first alloy and a second alloy, mixed in a flux. The liquidus temperature of the first alloy and the liquidus temperature of the second alloy differ by not greater than about 15° C.
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申请公布号 |
US2006021466(A1) |
申请公布日期 |
2006.02.02 |
申请号 |
US20050209076 |
申请日期 |
2005.08.22 |
申请人 |
GOUDARZI VAHID;BRADLEY EDWIN L;FARIELLO BRIAN A |
发明人 |
GOUDARZI VAHID;BRADLEY EDWIN L.;FARIELLO BRIAN A. |
分类号 |
C22C13/00;B23K35/02;B23K35/26;H05K3/34 |
主分类号 |
C22C13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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