发明名称 Mixed alloy lead-free solder paste
摘要 This invention is to a mixed alloy lead-free solder paste, a method of making the solder paste, and a method of using the solder paste. The solder paste comprises particles of a first alloy and a second alloy, mixed in a flux. The liquidus temperature of the first alloy and the liquidus temperature of the second alloy differ by not greater than about 15° C.
申请公布号 US2006021466(A1) 申请公布日期 2006.02.02
申请号 US20050209076 申请日期 2005.08.22
申请人 GOUDARZI VAHID;BRADLEY EDWIN L;FARIELLO BRIAN A 发明人 GOUDARZI VAHID;BRADLEY EDWIN L.;FARIELLO BRIAN A.
分类号 C22C13/00;B23K35/02;B23K35/26;H05K3/34 主分类号 C22C13/00
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