发明名称 |
Method and apparatus for producing co-planar bonding pads on a substrate |
摘要 |
A method and apparatus for producing a substrate having a plurality of substantially co-planar bonding pads is provided. The substrate is employed in a probe apparatus used in wafer testing of wafer-mounted semiconductor integrated circuits. The bonding pads are formed by applying a plurality of bumps of electrically conductive material to a mounting surface of the substrate using a dispensing mechanism. The bumps are subsequently deformed into a plurality of substantially co-planar bonding pads using a flattening tool. The bonding pads provide a planar surface to which probes may be mounted, improving the accuracy and precision of positioning of tips of the probes.
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申请公布号 |
US2006022690(A1) |
申请公布日期 |
2006.02.02 |
申请号 |
US20050190092 |
申请日期 |
2005.07.26 |
申请人 |
K&S INTERCONNECT, INC. |
发明人 |
MALANTONIO EDWARD L.;LAURENT EDWARD;HANOON ILAN |
分类号 |
H01L21/66;G01R31/02;H01L21/44 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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