DIE BONDER FOR LASER CRYSTAL

摘要

A die bonder for laser crystal in which bonding is performed extremely uniformly in the laser crystal face with high thermal conduction without causing any damage to a reflection control film attached to a laser crystal or the surface thereof. In the die bonder for bonding a laser crystal to a heat sink, a spring (9) located between a pin holding part (8) engaging with a pin seating base (10) and a pin flange part (7A) can slide a pin (7) vertically from the pin holding part (8). Under a state where the laser crystal (6) is pressed against the heat sink (4) with a predetermined pressure by touching the forward end face of the pin (7) onto the laser crystal (6), the laser crystal (6) is heated and secured to the heat sink (4).