| 摘要 |
PROBLEM TO BE SOLVED: To restrain the displacement of a bump position due to heat from a stage in a bump bonder for forming bumps on electrodes of an IC chip by bonding balls formed on wire tips. SOLUTION: An air-blowing tube 25 is interposed between a stage 2 and a bonding head 3. The stage 2 is heated to a predetermined temperature and has an IC chip 1 positioned and fixed thereon. The head 3, which is arranged on one side of the stage 2 so as to be movable in a horizontal direction, forms a bump on the electrode of the chip 1 by bonding a ball formed at the tip of a wire 10. The tube 25 has many outlets for blowing the air in a direction opposite to the head 3. The tube 25 forms streams of air which is substantially in parallel along the upper surface of the stage 2, so that the heat derived from the stage 2 affecting the bonding head 3 is restrained. |
