Opto-electronic device, and method of manufacturing

摘要

An optical or electronic component has an active area exposed to the surrounding environment and is enclosed in a plastic housing(4). The housing comprises a first area(41) of transparent plastic around the active area of the component and a second area(42) of opaque plastic. An opening(43) through the second plastic(42) exposes the first plastic(41) and the active area of the component(1) to the environment. An outward facing area(41a) of the first plastic is designed to guide light. Opaque plastic to the side of the transparent plastic encapsulates additional module components(2). A component and transparent plastic section may be prefabricated as a package which is positioned on a carrier part of the module and the opaque plastic partly surrounds the package leaving the transparent plastic exposed. The opto-electronic component(1) and an additional component may be mounted on opposite sides of a carrier plate and the additional component is encapsulated by the opaque plastic. Independent claims are included for various processes for manufacturing an electronic or optical module with a plastic housing. A) in a first process: a) an electronic or optical component(1) is encapsulated in transparent plastic(41); b) the transparent plastic and additional components(2) are encapsulated by a second, opaque plastic(42); part of the opaque plastic is removed to create an opening(43) exposing the first plastic and active area of the first component to the environment. B) in a second process: a) a prefabricated package is prepared comprising an optical or electronic component encapsulated in a transparent plastic; b) the package is positioned on a carrier plate; c) the package and additional components are partially encapsulated in an opaque plastic which leaves the transparent plastic exposed to atmosphere. C) in a third process: a) a prefabricated package is prepared comprising an optical or electronic component encased in a transparent plastic; b) the package is mounted on a carrier plate; c) the package, carrier plate and additional components are encapsulated in opaque plastic; d) part of the opaque plastic is removed to expose the transparent plastic and the active area of the component.