| 摘要 |
A copper-clad laminate is provided which includes an insulative substrate having laminated on one or either side thereof a copper foil whose one side is roughened, the copper foil having formed on the roughened surface side thereof a metal layer whose melting point is lower than that of zinc. There is also provided a circuit board for a printed wiring board, including an insulative substrate having a conductive circuit formed on one side thereof and viaholes formed in through-holes extending from the other side of the insulative substrate to the conductive circuit, there being formed between the one side of the insulative substrate and the conductive circuit a metal layer whose melting point is lower than that of zinc. No desmearing is required in making the circuit board, and so a circuit board for a multilayer printed wiring board can be produced which is superior in stability of the inter-layer electrical connection. <IMAGE> |
