Method for forming a copper layer over a semiconductor wafer
摘要
申请公布号
EP1050902(B1)
申请公布日期
2006.02.01
申请号
EP20000109329
申请日期
2000.05.02
申请人
FREESCALE SEMICONDUCTOR, INC.
发明人
SIMPSON, CINDY REIDSEMA;MIKKOLA, ROBERT DOUGLAS;HERRICK, MATTHEW T.;BAKER, BRETT CAROLINE;PENA, DAVID MORALEZ;ACOUSTA, EDWARD;CHOWDHURY, RINA;AZRAK, MARIJEAN;GOLDBERG, CINDY KAY;ISLAM, MOHAMMED RABIUL
