发明名称 Pressure sensitive sensor and method of treating a terminal of pressure sensitive sensor
摘要 <p>According to a pressure sensitive sensor and a method of treating a terminal of a pressure sensitive sensor of the invention, a covering portion is formed by a thermoplastic resin material for hot melt molding or a photo-curing resin material cured by absorbing light energy. That is, molding pressure in molding is lower than molding pressure in molding by a general injection molding method. Therefore, a possibility of effecting adverse influence on respective connecting portions of an electrode line, a resistor, a conductive piece and a lead wire by the molding pressure is extremely low and disconnection caused by operating the molding pressure on the connecting portions can reliably be prevented. </p>
申请公布号 EP1319788(A3) 申请公布日期 2006.02.01
申请号 EP20020027636 申请日期 2002.12.11
申请人 ASMO CO., LTD. 发明人 ISHIHARA, HIDENORI;TSUDA, HIROKAZU;KATO, MANABU
分类号 E05F15/00;G01L1/20;B60J5/04;B60J5/06;H01H1/58;H01H3/14;H01H13/18;H01H13/52 主分类号 E05F15/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利