发明名称 |
Pressure sensitive sensor and method of treating a terminal of pressure sensitive sensor |
摘要 |
<p>According to a pressure sensitive sensor and a method of treating a terminal of a pressure sensitive sensor of the invention, a covering portion is formed by a thermoplastic resin material for hot melt molding or a photo-curing resin material cured by absorbing light energy. That is, molding pressure in molding is lower than molding pressure in molding by a general injection molding method. Therefore, a possibility of effecting adverse influence on respective connecting portions of an electrode line, a resistor, a conductive piece and a lead wire by the molding pressure is extremely low and disconnection caused by operating the molding pressure on the connecting portions can reliably be prevented.
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申请公布号 |
EP1319788(A3) |
申请公布日期 |
2006.02.01 |
申请号 |
EP20020027636 |
申请日期 |
2002.12.11 |
申请人 |
ASMO CO., LTD. |
发明人 |
ISHIHARA, HIDENORI;TSUDA, HIROKAZU;KATO, MANABU |
分类号 |
E05F15/00;G01L1/20;B60J5/04;B60J5/06;H01H1/58;H01H3/14;H01H13/18;H01H13/52 |
主分类号 |
E05F15/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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