发明名称 |
Substrate for pre-soldering material and fabrication method thereof |
摘要 |
<p>A substrate for a pre-soldering material and a fabrication method of the substrate are proposed. The substrate having at least one surface formed with a plurality of conductive pads is provided. An insulating layer is formed over the surface of the substrate in such a way that a top surface of each of the conductive pads is exposed. Next, a conductive film and a resist layer are formed in sequence on the insulating layer and the conductive pads, wherein a plurality of openings are formed in the resist layer to expose a part of the conductive film above the conductive pad. Then, a pre-soldering material is deposited over the conductive pad by stencil printing or electroplating process.</p> |
申请公布号 |
EP1621278(A1) |
申请公布日期 |
2006.02.01 |
申请号 |
EP20040018152 |
申请日期 |
2004.07.30 |
申请人 |
PHOENIX PRECISION TECHNOLOGY CORPORATION |
发明人 |
HSU, SHIH-PING;HU, CHU-CHIN |
分类号 |
B23K1/20;H01L21/60 |
主分类号 |
B23K1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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