| 摘要 |
An aligning device for a wafer comprises a rotatable plate (1) carrying the wafer (10) and a device spaced from the plate to hold the wafer in position that can turn the plate without the wafer. The plate has two opposite inclined carrying surfaces (20) and the holder has inclined or conical bearing surfaces (53) holding the wafer edge only. An independent claim is also included for an aligning process for the above device. |
