发明名称 |
Method and apparatus for predicting the time to failure of electronic devices at high temperatures |
摘要 |
A method and apparatus are disclosed for determining a time to failure for an electronic device. The method and apparatus includes estimating a dependency of a bond strength degradation rate on at least one parameter and estimating a temperature profile of the electronic device. Furthermore, the method and apparatus determine a bond strength based on the dependency of the bond strength degradation rate and the temperature profile, and determine the time to failure for the electronic device based on a time evolution of the bond strength.
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申请公布号 |
US6993446(B2) |
申请公布日期 |
2006.01.31 |
申请号 |
US20030249117 |
申请日期 |
2003.03.17 |
申请人 |
SCHLUMBERGER TECHNOLOGY CORPORATION |
发明人 |
GUNAWARDANA RUVINDA;ETCHELLS RICHARD K. |
分类号 |
G01R31/00;G01R31/28 |
主分类号 |
G01R31/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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