发明名称 Stacked land grid array package
摘要 A spring plate may be provided between a bolster plate and a board in order to mount components on the opposite side of the board. In some embodiments, the spring plate may provide additional stack tolerance and forceful bias to hold the stack tightly together.
申请公布号 US6992373(B2) 申请公布日期 2006.01.31
申请号 US20040844765 申请日期 2004.05.13
申请人 INTEL CORPORATION 发明人 ZHENG TIEYU
分类号 H01L23/02;H01L23/04;H02B1/00;H05K7/10 主分类号 H01L23/02
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