发明名称 |
Method of manufacturing an IC package |
摘要 |
A method is provided for processing leadframe items of two or more types to form integrated circuit packages. The leadframe items are delivered along respective input paths and are received into holders, which are moved alternately between a processing region and a respective leadframe item reception position on a respective input path such that each of the holders moves to the processing region at a time when the other of the holders moves to its respective reception position. The leadframe items are delivered from the respective reception position to the processing region, and are then sent for encapsulation. |
申请公布号 |
SG118170(A1) |
申请公布日期 |
2006.01.27 |
申请号 |
SG20020007467 |
申请日期 |
2002.12.05 |
申请人 |
ASM TECHNOLOGY SINAPORE PTE LTD. |
发明人 |
WU JIAN;ZHOU YAN;HO SHU CHUEN;KUAH TENG HOCK |
分类号 |
H01L21/60;(IPC1-7):H01L21/56;B65G49/07 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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