首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
УСТАНОВКА ДЛЯ ОТОПЛЕНИЯ ТЕПЛИЦЫ
摘要
申请公布号
RU2004123750(A)
申请公布日期
2006.01.27
申请号
RU20040123750
申请日期
2004.08.02
申请人
Государственное образовательное учреждение высшего профессионального образовани Самарский государственный технический университет (RU)
发明人
Кудинов Анатолий Александрович (RU);Зиганшина Светлана Камиловна (RU)
分类号
A01G13/02;A01G13/06
主分类号
A01G13/02
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Method of forming fin-field effect transistor (finFET) structure
Semiconductor-on-insulator (SOI) deep trench capacitor
Structure and method for mobility enhanced MOSFETs with unalloyed silicide
SRAM devices utilizing strained-channel transistors and methods of manufacture
Pre-gate, source/drain strain layer formation
Structure and method for increasing strain in a device
Dual L-shaped drift regions in an LDMOS device and method of making the same
RF LDMOS device and fabrication method thereof
Forming array contacts in semiconductor memories
Semiconductor device
Strained channel for depleted channel semiconductor devices
Semiconductor-on-insulator (SOI) structure with selectivity placed sub-insulator layer void(s) and method of forming the SOI structure
Bipolar junction transistors with self-aligned terminals
Electronic component having encapsulated wiring board and method for manufacturing the same
Fuse circuit
E-fuse structures and methods of manufacture
Adjustable meander line resistor
Structure and method for making crack stop for 3D integrated circuits
Routing layer for mitigating stress in a semiconductor die
Leadframe pocket
