发明名称 |
Thermoelectric unit for cooling an electric or electronic device such as a chip or CPU has heat absorbing block thermal conductor thermoelectric cooler and front and rear coolers |
摘要 |
A thermoelectric unit for cooling an electrical device comprises a front heat-absorbing block (1) contacting an electronic device (100) with an attached front heat conductive unit (2), a front cooler (3), a thermoelectric cooler (4) whose cold side contacts the heat absorbing block and whose warm side contacts a rear cooler. An independent claim is also included for a unit as above comprises two thermoelectric cooler and two rear coolers.
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申请公布号 |
FR2873429(A3) |
申请公布日期 |
2006.01.27 |
申请号 |
FR20040008060 |
申请日期 |
2004.07.21 |
申请人 |
GIGA-BYTE TECHNOLOGY CO.,LTD |
发明人 |
TSENG HSIANG CHIEH;LIU YI SONG;CHOU CHIA MIN;YEH CHIA FENG |
分类号 |
F25B25/00;(IPC1-7):F25B25/00 |
主分类号 |
F25B25/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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