| 摘要 |
The invention provides a method for the removal of a microscopic sample 1 from a substrate 2, comprising: performing a cutting process whereby the substrate 2 is irradiated with a beam 4 such that the sample 1 is cut out of the substrate 2, and performing an adhesion process whereby the sample 1 is adhered to a probe 3 , characterized in that the cutting process, during at least part of the duration of the cutting process, is carried out by at least two beams 4, 5 simultaneously. By performing cutting with at least two beams, the sample 1 can be extracted without having to change the orientation of the substrate 2 with respect to the means that produce the beams. Both the act of working with two beams simultaneously and the attendant possibility of keeping the orientation constant provide time-savings compared to a method whereby cutting is only performed with a single beam.
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