发明名称 LAYERED MATERIAL AND CUTTING METHOD, MANUFACTURING DEVICE AND MANUFACTURING METHOD THEREOF
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a layered material cutting method capable of excellently cutting the layered material formed of layered different kinds of material at low costs, in regard to a layered material cutting method and a layered material. <P>SOLUTION: In the layered material 10 cutting method, a groove 16 is formed in one of a first board 12 and a second board 14, the one board formed with the groove is overlapped with the other board, while directing the groove toward the other board, and laser 18 is radiated to the first board and the second board along the groove from a side of the one board formed with the groove to cut the layered material formed of the first board and the second board. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006021315(A) 申请公布日期 2006.01.26
申请号 JP20050167235 申请日期 2005.06.07
申请人 FUJITSU LTD 发明人 FURUI JUICHI;MATSUSHITA NAOHISA
分类号 B81C3/00;H01L21/301 主分类号 B81C3/00
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