| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board of multiple allocation possessing a plurality of wiring boards having a plurality of surface electrodes coated with the same or different kind of metal plate individually and minutely on the surface or the like of the substrate body, and to provide a manufacturing method capable of permitting the efficient manufacture of the wiring board of multiple allocation. SOLUTION: A wiring board of multiple allocation 1 includes: a base substrate 2 comprising an insulating layer possessing a plurality of substrate bodies k of the wiring boards which become product units along the plane direction; a plurality of external connection terminals that are formed along the thickness direction in the side 6 of the base substrate 2, and a first wiring layer 24 and a second wiring layer 26 that are built in each substrate body k and formed as mutually independent circuits. The plurality of the external connection terminals are provided with a first external connection terminal 10a that can be conductive only to the first wiring layer 24 and a second external connection terminal 10b that can be conductive only to the second wiring layer 26. COPYRIGHT: (C)2006,JPO&NCIPI |
