| 摘要 |
PROBLEM TO BE SOLVED: To highly densely place an IC chip and a surface-mounted component on a flexible printed board. SOLUTION: The IC chip is mounted on one of surfaces of a single flexible printed board including a conductor formed in a circuit pattern while electrically connected with the conductor via a conductive adhesive film. On the other hand, the surface mounted component other than the IC chip is mounted while electrically connected with the conductor by means of reflow soldering on the other surface including the rear face of the mounted position of the IC chip. The flexible printed board includes a conductor formed in the circuit pattern on both surfaces of a single insulation resin layer, having the IC chip mounted on the conductor on one of the surfaces, and having the surface mounted component other than the IC chip mounted on the conductor on the other surface. COPYRIGHT: (C)2006,JPO&NCIPI
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