| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting board having higher heat radiating property without increase in the number of components. SOLUTION: The substrate for mounting 30 to be mounted on a base substrate (main substrate arranged in the upper side of the figure such as leg portion 35 explained later) is formed by molding of an insulating material through processing of a metal plate material, and by mounting circuit components (FET7 or the like) including circuit component generating higher heat. This substrate for mounting 30 also comprises a rectangular plate shape substrate portion 32 provided therein with a circuit pattern 31 formed with processing of the plate material to mount the circuit components; the leg portions 35 to 37 extended in almost orthogonal from the side of both ends of the substrate portion 32 to arrange therein the connecting conductors 33a to 33g formed by processing the plate material, and to form, at the end part thereof, the connecting terminals 34a to 34g to the base substrate with the end of the connecting conductors exposed from the mold; and a heat radiating plate 38 provided at one end side of the substrate portion 32 through processing of the plate material. This heat radiating plate 38 is provided with a non-molded heat radiating part 38a extending from the substrate portion 32. COPYRIGHT: (C)2006,JPO&NCIPI
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