| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic module compatible with a change in the array sequence of the terminals of an electronic substrate, and its manufacturing method, and an electronic apparatus. SOLUTION: The electronic module has an electronic substrate 110 and an interconnect substrate 150. The interconnect substrate 150 includes a plurality of second terminals 160, 162, and 164 to be electrically connected to first terminals 120, 122, and 124 of the electronic substrate 110, two or more first interconnects 166 extending from the two or more second terminals 160, and two or more second interconnects 168 constituted by being formed while being electrically insulated from the first interconnects 166. The at least one first interconnects 166 and the at least one second interconnects 168 are electrically connected by an electrical connection section 170. COPYRIGHT: (C)2006,JPO&NCIPI
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