| 摘要 |
A method of manufacturing a semiconductor package having a double encapsulant structure. The method comprises preparing a group substrate. The group substrate includes a plurality of semiconductor chips arranged on the top surface, which chips typically are stacked. The semiconductor chips are electrically connected with the group substrate by bonding wires. A first liquid molding compound covers the top surface of the group substrate to form a first encapsulant. A second liquid molding compound covers the first encapsulant to form a second encapsulant. The group substrate may be divided into individual semiconductor packages. The second encapsulant-which includes a smaller percentage by weight of filler than does the first encapsulant-typically covers an incomplete molding portion of the first encapsulant. Accordingly, the invention reduces the overall thickness of the encapsulant and ensures complete molding.
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