发明名称 |
Manufacturing method for semiconductor devices, arrangement determination method and apparatus for semiconductor device formation regions, and program for determining arrangement of semiconductor device formation regions |
摘要 |
With use of a length-dimension of a second-line-segment of a unit-device-formation-region as an arrangement interval, a plurality of parallel lines are disposed in a device-formation-effective-region on a wafer so as to form a plurality of parallel-line-partition-regions, the unit-device-formation-regions are arranged in each of the parallel-line-partition-regions independently of and separately from other parallel-line-partition-regions so that the acquisition number of the unit-device-formation-regions is maximized, and an arrangement of the respective unit-device-formation-regions in the respective parallel-line-partition-regions is determined as an arrangement of the entire device-formation-effective-region.
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申请公布号 |
US2006019416(A1) |
申请公布日期 |
2006.01.26 |
申请号 |
US20050183739 |
申请日期 |
2005.07.19 |
申请人 |
ARITA KIYOSHI;HAJI HIROSHI;NODA KAZUHIRO;NAKAGAWA AKIRA;NISHINAKA TERUAKI |
发明人 |
ARITA KIYOSHI;HAJI HIROSHI;NODA KAZUHIRO;NAKAGAWA AKIRA;NISHINAKA TERUAKI |
分类号 |
H01L21/66;G01R31/26 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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地址 |
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