摘要 |
A UV-ray irradiator comprising a UV-ray irradiating section (12) having a plurality of UV-ray emitting diodes (21) arranged on a substrate (20) and disposed oppositely to a body being irradiated, i.e. a semiconductor wafer, applied with a protective sheet S through a UV-curing adhesive layer. The UV-ray emitting diodes (21) are arranged, at a constant interval, on a plurality of lines L1 substantially perpendicularly intersecting the direction of relative movement with respect to the wafer such that a part of the UV-ray emitting diodes (21) in the adjacent row is located between the adjacent UV-ray emitting diodes (21) in each row. |