| 摘要 |
A semiconductor device is disclosed, which comprises a semiconductor substrate, a semiconductor element formed on the semiconductor substrate, and multi-level wiring structure including first wirings at a plurality of levels, in which the first wirings at at least one of the levels are provided at different heights in a cross-sectional view of the multi-level wiring structure, and extend to cross at an oblique angle with the first wirings at an adjacent level in a plan view.
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