Semiconductor device, has one semiconductor chip including set of bumps with different heights is face-bonded on either of mount substrate and another chip, which is die-bonded on mount substrate

摘要

The device has a mount substrate (71) and two semiconductor chips (72, 73). The semiconductor chip (73) has a set of bumps with different heights. The chip (73) is face-bonded on either of the mount substrate and the chip (72), which is die-bonded on the mount substrate. Whole of the semiconductor chip (72) is disposed within an area of the semiconductor chip (73).