PROBE CASSETTE, SEMICONDUCTOR INSPECTING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

A full wafer inspecting apparatus, which ensures leading edge position accuracy of a contact terminal and surely inspects semiconductor elements formed on a wafer in batch, and a semiconductor device manufacturing method are provided. A probe cassette to be used in the semiconductor inspecting apparatus is provided with a probe sheet (31), which has a plurality of contact terminals (7) which are brought into contact with an electrode (3) of the wafer (1) and has a plurality of contact bumps (20b) electrically connected with each of the contact terminals (7); and a probe sheet (34), which has a plurality of contact electrodes (34a) which are brought into contact with the contact bump (20b) of the probe sheet (31) and has a plurality of peripheral electrodes (27b) electrically connected with each of the contact electrodes (34a). The probe card sandwiches the wafer (1) with the probe sheet (34) by depressurization through the probe sheet (31), and inspection is performed by bringing the contact terminal (7) into contact with the electrode (3) of the wafer (1) at a desired air pressure. The contact terminal (7) is formed in pyramid or truncated pyramid, and the probe sheet (34) is lined with a metal film (30b).