| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a side-view semiconductor light emitting device capable of obtaining high brightness by efficiently reflecting light emerged from an LED chip to a front face side and being downsized by eliminating a projection from a resin mold. <P>SOLUTION: A first lead 1 formed of a platelike material and equipped with a bowl-like recess 1a at its tip and a second lead 2 are provided side by side. Part of the tip of the first lead 1 is displaced in parallel to the surface of the platelike material to serve as a first mounting face 1b, and the tip of the second lead 2 is also displaced in parallel to the surface of the platelike material to serve as a second mounting face 2b. The LED chip 3 is mounted in the recess 1a, and two electrodes thereof are electrically connected with the first and second leads 1 and 2 via a connection means 4. The entire surface except the first and second mounting faces 1b and 2b and cut surfaces of the leads is covered with the resin mold 5. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
