| 摘要 |
PROBLEM TO BE SOLVED: To provide a filler which can give such an epoxy resin composition for use in the encapsulation of a semiconductor as has a low viscosity even in a high packing, therefore as is excellent in the flowability and moldability, and furthermore as corresponds to the thin-making of a semiconductor package and to the miniaturization of a wiring clearance. SOLUTION: The filler used is of inorganic particles which are covered with a cured epoxy resin. Such filler has a larger effect on the reduction of the viscosity, comparing to that of a filler covered with an uncured epoxy resin or a cured different resin, and can be manufactured by the steps of stirring the powder of inorganic particles such as spherical silica and subsequently spraying thereupon a solution containing an epoxy resin and a hardener, and adsorbing these epoxy resin and hardener on the surface of the inorganic particles and then polymerizing and hardening the epoxy resin by heating or the like. COPYRIGHT: (C)2006,JPO&NCIPI
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