发明名称 PRESSURE-SENSITIVE ADHESIVE SUPPORT
摘要 PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive support wherein the pressure-sensitive adhesive layer scarcely forms chips when objects to be supported are attached to or detached from the surface of the layer. SOLUTION: The pressure-sensitive adhesive support is one which is composed of a substrate 12 and a pressure-sensitive adhesive layer laminated thereon and supports the objects 16 by pressure-sensitive adhesiveness on the surface of the layer 14, wherein the layer 14 comprises a cured product of a pressure-sensitive adhesive composition comprising an unvulcanized silicone rubber, a crosslinking component, a tackifying component, a platinum compound, and silica, and the silica has a specific surface area of at least 50 m<SP>2</SP>/g. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006022168(A) 申请公布日期 2006.01.26
申请号 JP20040199969 申请日期 2004.07.07
申请人 SHIN ETSU POLYMER CO LTD 发明人 HARUNO HIROSHI
分类号 C09J183/04;C09J7/02;C09J11/00 主分类号 C09J183/04
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