| 摘要 |
A semiconductor etching apparatus includes an electrostatic chuck, an edge ring and a spacer. The electrostatic chuck includes a ring mounting part. The edge ring has an outer part and an inner part. The outer part has a thickness greater than a height of the ring mounting part, and the inner part is disposed to be proximate to the vertical surface of the ring mounting part. Upper and lower surfaces of the inner part are stepped upward and downward, respectively, by the same height from upper and lower surfaces of the outer part. The spacer is ring-shaped, is disposed on a horizontal surface of the ring mounting part, supports the inner part of the edge ring member, and has a thickness that is the same as the height between the lower surface of the outer part and the upper surface of the inner part of the edge ring member.
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