发明名称 |
Method for forming redistribution bump, semiconductor chip and mount structure fabricated using same |
摘要 |
<p>Provided are a method of forming a bump whose upper surface is substantially flat and whose area can be enlarged in a uniform pad pitch to simplify mounting a liquid crystal display drive IC (LDI) and a semiconductor chip and a mount structure using the method to minimize a pad area inside the chip. Thus, the pad area on an edge of a conventional chip is minimized and the bump is formed in a substantially flat location inside the chip and an electrical connection between the pad and the bump is performed by a redistribution metal line.</p> |
申请公布号 |
KR100546346(B1) |
申请公布日期 |
2006.01.26 |
申请号 |
KR20030050496 |
申请日期 |
2003.07.23 |
申请人 |
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发明人 |
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分类号 |
H01L21/60;H01L21/44;H01L23/31;H01L23/485 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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