| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for surely dividing a wafer when a modifying layer is formed by an irradiation with laser beams and the wafer is divided along a division predetermined line. <P>SOLUTION: The method for dividing the wafer contains a modifying-layer forming step, in which the modifying layer is formed in the wafer 2 along the division predetermined line by laser beams, and a wafer supporting step in which the backside of the wafer is stuck on an extensible carrier tape mounted on an annular frame. The method further contains a dividing step in which the wafer is divided along the division predetermined line by expanding the carrier tape having the stuck wafer. In the dividing step, the carrier tape is expanded so that a tensile force working in the direction orthogonal to the division predetermined line extended in a given direction is made larger than that working in the direction orthogonal to the division predetermined line extended in the direction crossed with the given direction when the carrier tape having the stuck wafer is expanded. Accordingly, the wafer is divided first along the division predetermined line extended in the given direction, and divided successively along the division predetermined line extended in the direction crossed with the given direction in the dividing step. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
