| 摘要 |
PROBLEM TO BE SOLVED: To enable a face-down assembly with an excellent reproducibility at a narrow space of≤50μm or less even in three or more of multielement array laser, and to reduce within several% the instability of an optical output participating in the heat-dissipating properties of an element such as drooping characteristics, a crosstalk or the like. SOLUTION: Laser chips are assembled on a sub-mount to which electrodes and semiconductor patterns are formed in the direction crossed with a resonator, by a face-down manner by coating the first electrodes for the laser chips with insulators and boring conductive holes in the array type semiconductor laser. COPYRIGHT: (C)2006,JPO&NCIPI
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