发明名称 |
Microstructured infrared sensor and method for its manufacture |
摘要 |
A microstructured infrared sensor includes: a sensor chip having a diaphragm; a cavity formed underneath the diaphragm; a thermopile structure formed on the diaphragm and having bonded printed conductors; an absorber layer formed on the thermopile structure for absorbing infrared radiation; and a cap chip attached to the sensor chip. A sensor space is formed between the cap chip and the sensor chip, and the sensor space accommodates the thermopile structure. The infrared sensor also includes a convex lens area for focusing incident infrared radiation onto the absorber layer. The lens area may be formed on the top of the cap chip or on a lens chip attached to the cap chip. The lens area may be formed by drying a dispensed lacquer droplet, or by a softened, structured lacquer cylinder, or by subsequent etching of the dried lacquer droplet and the surrounding substrate material.
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申请公布号 |
US2006016995(A1) |
申请公布日期 |
2006.01.26 |
申请号 |
US20050150762 |
申请日期 |
2005.06.10 |
申请人 |
KUMMER NILS;MUELLER-FIEDLER ROLAND;FINKBEINER STEFAN;MUELLER ANDRE;MUENZEL HORST;MAURER DIETER;HIEMER STEFAN;PERTHOLD JURGEN |
发明人 |
KUMMER NILS;MUELLER-FIEDLER ROLAND;FINKBEINER STEFAN;MUELLER ANDRE;MUENZEL HORST;MAURER DIETER;HIEMER STEFAN;PERTHOLD JURGEN |
分类号 |
G01J5/00 |
主分类号 |
G01J5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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