发明名称 |
CONTINUOUS CONTOUR POLISHING OF A MULTI-MATERIAL SURFACE |
摘要 |
<p>A chemical-mechanical polishing pad, and method of polishing a substrate using a polishing pad, comprising (a) a resilient subpad, and (b) a polymeric polishing film substantially coextensive with the resilient subpad, wherein the polymeric polishing film comprises (i) a polishing surface that is substantially free of bound abrasive particles, and (ii) a back surface releasably associated with the resilient subpad.</p> |
申请公布号 |
WO2006009634(A1) |
申请公布日期 |
2006.01.26 |
申请号 |
WO2005US20532 |
申请日期 |
2005.06.10 |
申请人 |
CABOT MICROELECTRONICS CORPORATION |
发明人 |
STECKENRIDER, SCOTT;SNIDER, GARY |
分类号 |
B24B37/04;B24D13/14;(IPC1-7):B24B37/04 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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