| 摘要 |
PROBLEM TO BE SOLVED: To provide a breaking expander that divides a wafer put on a film sheet into chips and expands the chips on the film sheet. SOLUTION: In the breaking expander, a plurality of spheres 109 partially protruded from the stage surface 106a of a ball guide 106 is arranged on an expansion stage 100. When the spheres 109 are moved in a radial direction simultaneously with the rotation of the stage surface 106a so that one sphere 109 may move on a continuous spiral locus and brought into contact with the diced wafer, the spheres 109 divide the wafer into the chips by breaking the grooves provided on the wafer. COPYRIGHT: (C)2006,JPO&NCIPI |
