| 摘要 |
PROBLEM TO BE SOLVED: To provide an interposer manufacturing method which can manufacture an interposer by a simple manufacturing process without generating any cavity inside a through hole. SOLUTION: In the manufacturing method of the interpose, a seed layer 14 is first formed in an opening of the through hole 13 in the rear surface 12 side of a substrate 10. With the seed layer 14 as a base, an electrode layer 15 for plating is formed. From the electrode layer 15 for plating, a plating layer 16 is formed toward the front surface 11 side of the substrate 10 to fill up the through hole 13 with it. COPYRIGHT: (C)2006,JPO&NCIPI |
