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发明名称
METHOD FOR ASSEMBLING SEMICONDUCTOR MODULE USING THERMAL INDUCED ADHESIVE
摘要
申请公布号
KR20060007849(A)
申请公布日期
2006.01.26
申请号
KR20040057248
申请日期
2004.07.22
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
BANG, HYO JAE
分类号
H01L23/28
主分类号
H01L23/28
代理机构
代理人
主权项
地址
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