| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LED package which has high heat dissipation and displays high durability when it is joined with metallic members such as a radiation fin or the like. <P>SOLUTION: The package for housing a light emitting device has a recess in the front surface side of an insulating substrate to house a light emitting device. An aluminum nitride sintered body is used as a material for the insulating substrate, and its particle size with an accumulated value of 50% is ≥3 μm and <10 μm, and a differenece between the particle sizes with accumulated values of 90% and 10% is 2.5-6.0 μm in the particle distribution curve of aluminum nitride crystal particles. A grain boundary phase lacking layer wherein the measured value of an X-ray diffraction strength ratio of aluminum nitride phase to aluminum nitride grain boundary phase is ≤0.8 as compared with the measured value thereof in the inside exists at a thickness of 1-100 μm from the surface, and the aluminum nitride sintered body contains a sintering auxiliary agent. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
