发明名称 GRINDING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a grinding apparatus capable of grinding a workpiece to the predetermined finishing thickness, without being influenced by a variation in the thickness of a protective tape, even if a reverse surface is ground by sticking the protective tape to a surface of the workpiece. SOLUTION: This grinding apparatus has a chuck table having a holding surface for holding the workpiece, a grinding means for grinding the workpiece held by the holding surface of the chuck table, a grinding feeding means for feeding the grinding means for grinding in the perpendicular direction to the holding surface of the chuck table, and a height gauge for detecting a height position of an upper surface of the workpiece held by the chuck table; and has a thickness measuring apparatus for detecting the thickness of the workpiece, and a control means for controlling the grinding means and the grinding feeding means on the basis of detecting data from the thickness measuring apparatus and the height gauge. The control means calculates a target grinding quantity from the thickness of pre-processing workpiece detected by a thickness detector and finishing thickness data on the workpiece, and grinds up to reaching a height position corresponding to the target grinding quantity from the height position of the pre-processing workpiece on the basis of the detecting data from the height gauge. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006021264(A) 申请公布日期 2006.01.26
申请号 JP20040200358 申请日期 2004.07.07
申请人 DISCO ABRASIVE SYST LTD 发明人 TAKAZAWA TORU
分类号 B24B49/02;B24B7/22;H01L21/304 主分类号 B24B49/02
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