发明名称 |
Substrate-based BGA package, in particular FBGA package |
摘要 |
A ball grid array package includes a substrate. A number of solder balls overlie the solder ball surface of the substrate. The solder balls are arranged within a ballout area. A chip is attached to the chip surface of the substrate by an adhesive layer. Contact pads of the chip are electrically connected to ones of the solder balls. The chip has an area that is smaller than the ballout area and the adhesive layer has an area that is at least as large as the ballout area such that each solder ball in the ballout area is located beneath the adhesive layer.
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申请公布号 |
US2006017149(A1) |
申请公布日期 |
2006.01.26 |
申请号 |
US20050155332 |
申请日期 |
2005.06.17 |
申请人 |
REISS MARTIN;LEGEN ANTON;KROEHNERT STEFFEN |
发明人 |
REISS MARTIN;LEGEN ANTON;KROEHNERT STEFFEN |
分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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